• Fully digital chip architecture
• AT command host interface up to 115.2Kbaud
• Integrated ISDN S/T-controller with
  B- and D-channel HDLC support
• I.430 ITU S/T ISDN support in TE mode
• Layer 1 I.430
• Layer 2 Q.921
• Layer 3 Q.931
• 6 independent read and write
  HDLC-controllers for B1, B2 and D-channel
• Integrated FIFOs: 64 bytes per channel and direction
• 2 Audio CODECs for handsets
• 32-bit ARM7 microprocessor
• 8MB SRAM
• 4MB Flash

Application Areas:

• Telecommunication gateways
• Protocol converters
• Mobile Access Routers (MAR)
• Communication gateways
• Distributed I/O and control
• Diagnostics and data acquisition

The COM-1230 is a High Reliability intelligent embedded PC/104 ISDN telecommunications module featuring an integrated ARM7 microprocessor. This communications module provides a serial port interface up to 115.2Kbaud using either TTL or RS-232 signal levels. Host control is performed using direct AT commands. A S/T-interface with layer 1, 2 and 3 functions for the D, B1 and B2 channel. The two integrated Audio CODECs can be used for connecting to telephone handsets.

Other network and communication related products:

• COM-1240 Intelligent MVB bus interface module
• COM-1273 Dual channel isolated CAN controller
• COM-1274 8 serial port and 82527 CAN bus interface module
• COM-1267 5-port 10/100Mbit Ethernet switch
• COM-1461 IEEE-1394b Firewire interface module
• COM-1440 4-port USB 2.0 interface module

General Board Features:

• Power: +5.0Vdc +/- 5%; 2W
• Humidity: 10% to 95%, non-condensing
• Operating Temperature: -20 to +70°C

Physical Characteristics:

• Dimensions: 90 X 96 mm (3.6"X3.8"), height 15 mm (0.6")

Order Code:

• [COM-1230-00] COM-1230 PC/104 ISDN Module 8MB SRAM 4MB Flash, 2 Audio CODEC

Options:

• Conformal coating
• Custom connectors